Estabelecer UMA plataforma de negociação fiável para Fabricantes e fornecedores globais.
Series :
Contact Finish - Mating :
Number of Positions or Pins (Grid) :
27434 Produto
Imagem Modelo Preço Número Existências Fabricante Descrever Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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Samtec Inc. CONN SOCKET PLCC 32POS TIN Obsolete                                
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Samtec Inc. CONN SOCKET PLCC 32POS TIN Obsolete                                
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Samtec Inc. CONN SOCKET PLCC 32POS TIN PLCC Obsolete   -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin   Tin 32 (2 x 7, 2 x 9) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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Empresa
$188.6880
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3M BGA 1MM 25 25MM 23 MATRIX 168PIN   Active                                
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Empresa
$154.1100
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3M BGA SOCKET 1MM 676 POS 26X26   Active           BGA                    
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Empresa
$91.6360
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3M 10X10 GRID ZIP SOCKET   Active   -55°C ~ 150°C Through Hole Solder Closed Frame   Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 100 (10 x 10) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Empresa
$57.8180
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3M BGA 1.00MM 9X9 8X8 64 PIN   Active                                
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Empresa
$34.4000
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TE Connectivity AMP Connectors CONN SOCKET LGA 2011POS GOLD   Active     Surface Mount Solder Open Frame LGA Thermoplastic   Gold 30.0µin (0.76µm) Gold 2011 (47 x 58) Copper Alloy   30.0µin (0.76µm) Copper Alloy
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Empresa
$16.1600
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TE Connectivity AMP Connectors DUAL LGA,257 POS, DMD SOCKET DMD Active   -25°C ~ 100°C Surface Mount Solder Board Guide, Open Frame LGA Thermoplastic 0.039" (1.00mm) Gold 3.00µin (0.076µm)   257 (20 x 30) Copper Alloy      
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Empresa
$14.2600
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TE Connectivity AMP Connectors CONN SOCKET LGA 1151POS GOLD   Active     Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) Gold 1151 Copper Alloy 0.036" (0.91mm) 15.0µin (0.38µm) Copper Alloy
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Empresa
$6.4400
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Threaded Solder   SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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Empresa
$6.1600
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 32POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (1 x 32) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Empresa
$5.2400
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 32POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Empresa
$4.3900
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Empresa
$2.4500
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 18POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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Empresa
$2.4300
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 20POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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Empresa
$2.0900
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 14POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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Empresa
$1.6600
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active   -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold Flash Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) Flash Beryllium Copper
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Empresa
$1.5400
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Omron Electronics Inc-EMC Div CONN IC DIP SOCKET 8POS GOLD XR2 Active   -55°C ~ 125°C Threaded Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
D01-9933246
Empresa
$7.3000
Ver
RFQ
100
Disponível EM stock
Harwin Inc. CONN SOCKET SIP 32POS TIN D01-993 Active   -55°C ~ 125°C Through Hole Solder Cup   SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin   Tin 32 (1 x 32) Brass 0.100" (2.54mm)   Brass
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450
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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Empresa
$2.7500
Ver
RFQ
450
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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Empresa
$1.8981
Ver
RFQ
450
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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Ver
RFQ
700
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN Active                                
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Empresa
$2.1600
Ver
RFQ
700
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN Active                                
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Empresa
$1.2723
Ver
RFQ
700
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 16POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 16 (2 x 8) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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Ver
RFQ
450
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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Empresa
$1.4100
Ver
RFQ
450
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN Active                                
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Empresa
$0.9520
Ver
RFQ
450
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 8POS TIN iCF Active   -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Liquid Crystal Polymer (LCP) 0.100" (2.54mm) Tin   Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm)   Beryllium Copper
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Ver
RFQ
275
Disponível EM stock
Samtec Inc. CONN IC DIP SOCKET 32POS TIN Active