- Part Status :
- Operating Temperature :
- Package / Case :
-
- 100-LQFP Exposed Pad (1)
- 20-TSSOP (0.173", 4.40mm Width) Exposed Pad (2)
- 24-VFQFN Exposed Pad (11)
- 253-LFBGA, FCCSP (1)
- 28-TSSOP (0.173", 4.40mm Width) (2)
- 32-VFQFN Exposed Pad (2)
- 32-WFQFN Exposed Pad (3)
- 36-VFQFN Exposed Pad (3)
- 40-VFQFN Exposed Pad (2)
- 48-BSSOP (0.295", 7.50mm Width) (1)
- 48-TFSOP (0.240", 6.10mm Width) (2)
- 48-VFQFN Exposed Pad (1)
- 56-BSSOP (0.295", 7.50mm Width) (1)
- 64-VFQFN Exposed Pad (6)
- 72-VFQFN Exposed Pad (3)
- 8-SOIC (0.154", 3.90mm Width) (1)
- Supplier Device Package :
-
- 100-TQFP (14x14) (1)
- 20-TSSOP (2)
- 24-QFN (4x4) (9)
- 24-VFQFPN (4x4) (2)
- 253-FCCSP (8x13.5) (1)
- 28-TSSOP (2)
- 32-VFQFPN (5x5) (2)
- 32-WQFN (5x5) (3)
- 36-QFN (6x6) (3)
- 40-VFQFPN (5x5) (2)
- 48-SSOP (1)
- 48-TSSOP (2)
- 48-VFQFPN (6x6) (1)
- 56-SSOP (1)
- 64-VFQFPN (9x9) (3)
- 64-VQFN (9x9) (3)
- 72-VFQFPN (10x10) (3)
- 8-SOIC (1)
- Main Purpose :
-
- Audio, MPEG (1)
- Ethernet (WAN), SONET/SDH/STM, Video (3)
- Ethernet, Fibre Channel, PCI Express (PCIe), Telecom (1)
- Ethernet, PCI Express (PCIe) (3)
- Ethernet, SONET/SDH, Stratum (3)
- Intel QPI, PCI Express (PCIe) (6)
- Memory, DDR4 (1)
- PCI Express (PCIe) (8)
- PCI Express (PCIe), SATA CPU (3)
- SONET/SDH, DWDM (2)
- Telecom (1)
- Differential - Input:Output :
- Filtro seleccionado :
72 Produto
| Imagem | Modelo | Preço | Número | Existências | Fabricante | Descrever | Series | Part Status | Operating Temperature | Mounting Type | Package / Case | Frequency - Max | Supplier Device Package | Number of Circuits | Voltage - Supply | Output | Main Purpose | Input | Ratio - Input:Output | PLL | Differential - Input:Output | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Ver | Maxim Integrated | INTEGRATED CIRCUIT | Obsolete | |||||||||||||||||
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Ver | Maxim Integrated | INTEGRATED CIRCUIT | Obsolete | |||||||||||||||||
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Ver | Maxim Integrated | INTEGRATED CIRCUIT | Obsolete | |||||||||||||||||
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Ver | Maxim Integrated | INTEGRATED CIRCUIT | Obsolete | |||||||||||||||||
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Ver | Maxim Integrated | INTEGRATED CIRCUIT | Obsolete | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | IC DB1200ZL MUX DERIV 64VFQFPN | Last Time Buy | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 150MHz | 64-VFQFPN (9x9) | 1 | 3.14 V ~ 3.47 V | HCSL | Intel QPI, PCI Express (PCIe) | Clock | 1:12 | Yes | Yes/Yes | ||||
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Ver | IDT, Integrated Device Technology Inc | IC NETWORK TIMING VFQFPN | Last Time Buy | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | IC DB1200ZL MUX DERIV 64VFQFPN | Last Time Buy | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 150MHz | 64-VFQFPN (9x9) | 1 | 3.14 V ~ 3.47 V | HCSL | Intel QPI, PCI Express (PCIe) | Clock | 1:12 | Yes | Yes/Yes | ||||
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Ver | IDT, Integrated Device Technology Inc | IC NETWORK TIMING VFQFPN | Last Time Buy | |||||||||||||||||
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Ver | Semtech Corporation | MODULE CLEAREDGE CDR FC-CSP | Last Time Buy | |||||||||||||||||
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Ver | Semtech Corporation | MODULE CLEAREDGE CDR FC-CSP | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | IC BUFFER DIFF 72-VFQFPN | Last Time Buy | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | IC BUFFER DIFF 72-VFQFPN | Last Time Buy | |||||||||||||||||
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Ver | Microchip Technology | IC CLK DATA REC SDH 622MBPS | Discontinued at Digi-Key | -40°C ~ 95°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 622Mbps | 20-TSSOP | 1 | 3.135 V ~ 3.465 V | LVDS, LVPECL | SONET/SDH, DWDM | LVTTL | 1:2 | No | Yes/Yes | ||||
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Ver | Microchip Technology | IC CLK DATA REC SDH 622MBPS | Discontinued at Digi-Key | -40°C ~ 95°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad | 622Mbps | 20-TSSOP | 1 | 3.135 V ~ 3.465 V | LVDS, LVPECL | SONET/SDH, DWDM | LVTTL | 1:2 | No | Yes/Yes | ||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | -40°C ~ 85°C | Surface Mount | 72-VFQFN Exposed Pad | 650MHz | 72-VFQFPN (10x10) | 3 | Ethernet, SONET/SDH, Stratum | 6:4 | Yes | Yes/Yes | |||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | IC PLL WAN SYNC ETHERNET 100TQFP | Active | -40°C ~ 85°C | Surface Mount | 100-LQFP Exposed Pad | 622.08MHz | 100-TQFP (14x14) | 1 | 3 V ~ 3.6 V | CMOS, LVDS, PECL | Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | 4:2 | Yes | Yes/Yes | ||||
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Ver | IDT, Integrated Device Technology Inc | IC PLL WAN T1/E1/OC3 DUAL 72QFN | Active | -40°C ~ 85°C | Surface Mount | 72-VFQFN Exposed Pad | 650MHz | 72-VFQFPN (10x10) | 1 | 1.8V, 3.3V | CMOS, LVDS, PECL | Ethernet, SONET/SDH, Stratum | CMOS, LVDS, PECL | 6:10 | Yes | Yes/Yes | ||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | NETWORK TIMING | Active | |||||||||||||||||
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Ver | IDT, Integrated Device Technology Inc | IC PLL WAN 51/E1/OC3 DUAL 56SSOP | Active | -40°C ~ 85°C | Surface Mount | 56-BSSOP (0.295", 7.50mm Width) | 32.768MHz | 56-SSOP | 1 | 3 V ~ 3.6 V | CMOS, LVDS, TTL | Telecom | Clock | 2:12 | Yes | No/Yes | ||||
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Ver | IDT, Integrated Device Technology Inc | RDIMM | Active | Surface Mount | 253-LFBGA, FCCSP | 1MHz | 253-FCCSP (8x13.5) | 1.2V | Memory, DDR4 |
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