- Fabricante :
- Series :
- Operating Temperature :
- Plating - Thickness :
- Attachment Method :
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40 Produto
| Imagem | Modelo | Preço | Número | Existências | Fabricante | Descrever | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Ver |
2,272
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 CDC 16--FOLDED SERIE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Cadmium + Clear Chromate | Flash | Adhesive | ||
|
|
|
Ver |
1,527
Disponível EM stock
|
Leader Tech Inc. | 0.13 X 0.281 MAG 16--13-28U-MAG- | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Silver | Flash | Adhesive | ||
|
|
|
Ver |
2,830
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 BD 16--11-28RH-BD-16 | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
1,980
Disponível EM stock
|
Laird Technologies EMI | AP COIL BF USFT PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
1,143
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||
|
|
Ver |
3,798
Disponível EM stock
|
Laird Technologies EMI | GASKET BECU 7.11X609.6MM | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
Ver |
3,810
Disponível EM stock
|
Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Ver |
871
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 NI 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||
|
|
|
Ver |
3,420
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||
|
|
|
Ver |
1,348
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive | ||
|
|
|
Ver |
3,517
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 SN 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||
|
|
|
Ver |
2,921
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 SN 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||
|
|
|
Ver |
2,621
Disponível EM stock
|
Laird Technologies EMI | AP,STR,SU,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Ver |
3,993
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.23 SN 16--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | Flash | Adhesive | ||
|
|
|
Ver |
3,857
Disponível EM stock
|
Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||
|
|
|
Ver |
3,609
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
3,324
Disponível EM stock
|
Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Ver |
2,928
Disponível EM stock
|
Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||
|
|
|
Ver |
3,451
Disponível EM stock
|
Laird Technologies EMI | AP,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||
|
|
|
Ver |
3,297
Disponível EM stock
|
Laird Technologies EMI | AP,STR,ZNY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||
|
|
|
Ver |
1,055
Disponível EM stock
|
Laird Technologies EMI | AP,STR,ZNC,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||
|
|
|
Ver |
3,991
Disponível EM stock
|
Laird Technologies EMI | AP,STR,NID,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||
|
|
|
Ver |
3,640
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.24 BD 16.0--FOLD | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
2,671
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 BD 16--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
1,875
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 X 0.23 BD 16--FOLDED | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
Ver |
715
Disponível EM stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||
|
|
|
Ver |
2,850
Disponível EM stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||
|
|
|
Ver |
3,805
Disponível EM stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
1,597
Disponível EM stock
|
Laird Technologies EMI | AP,STR,BF,USF,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Ver |
1,734
Disponível EM stock
|
Leader Tech Inc. | 0.11 X 0.28 NI 16 NTP--FOLDED SE | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | Flash | Adhesive |
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