- Fabricante :
- Series :
- Operating Temperature :
- Height :
- Plating - Thickness :
- Attachment Method :
- Filtro seleccionado :
19 Produto
| Imagem | Modelo | Preço | Número | Existências | Fabricante | Descrever | Series | Part Status | Material | Operating Temperature | Type | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Ver |
1,952
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 X 130 SN 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||
|
|
|
Ver |
1,740
Disponível EM stock
|
Laird Technologies EMI | CSTR COIL ZNY | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||
|
|
|
Ver |
2,798
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 X 120 NI 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | ||
|
|
|
Ver |
1,205
Disponível EM stock
|
Laird Technologies EMI | CLO,STR,SNB,USFT | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.260" (6.60mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Tin | 299.21µin (7.60µm) | Clip | ||
|
|
|
Ver |
2,885
Disponível EM stock
|
Laird Technologies EMI | CSTR COIL BF USF | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
1,576
Disponível EM stock
|
Laird Technologies EMI | CSTR COIL NIB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||
|
|
|
Ver |
3,976
Disponível EM stock
|
Laird Technologies EMI | CSTR COIL NIE | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Nickel | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||
|
|
|
Ver |
1,369
Disponível EM stock
|
Laird Technologies EMI | CSTR COIL SNB | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.60m) | 1.090" (27.69mm) | Tin | 299.21µin (7.60µm) | Hardware, Rivet, Solder | ||
|
|
|
Ver |
1,881
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 NI 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | ||
|
|
Ver |
2,088
Disponível EM stock
|
Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | Large Enclosure | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 25.000 (7.62m) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder | ||
|
|
|
Ver |
2,986
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 BD 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
1,074
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 SN 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||
|
|
|
Ver |
2,255
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 SU 300"--FOLDED SERI | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
2,504
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 BD 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
3,428
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 SN 24--FOLDED SERIES | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 24.000" (609.60mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | ||
|
|
|
Ver |
1,011
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 X 130 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
813
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 X 120 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
1,951
Disponível EM stock
|
Leader Tech Inc. | 0.25 X 1.09 X 070 BD 16--25-109C | - | Active | Beryllium Copper | -55°C ~ 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | ||
|
|
|
Ver |
3,346
Disponível EM stock
|
Laird Technologies EMI | FINGERSTOCK BECU 27.69MMX406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware, Rivet, Solder |
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